PCB Material Selection
Candidate laminates compared against your frequency, loss, thermal and cost targets, with availability checked before quotation.
The right laminate for the job
Material choice affects loss, stability, thermal performance and cost. Share your targets and engineering returns candidate materials, trade-off notes and availability questions.
Supplier datasheet values are material data, not fabrication guarantees. Substitutions are used only with your approval.
What we consider
| Input | Why it matters |
|---|---|
| Frequency / data rate | Drives Dk stability and loss requirements |
| Dielectric and loss targets | Narrows the laminate families (FR-4, low-loss, PTFE) |
| Thermal requirement | Tg, Td and assembly temperatures, number of reflow cycles |
| Thickness and copper | Available core and prepreg constructions |
| Environment | CAF resistance, halogen-free, moisture, outdoor use |
| Cost target | Hybrid stack-ups can limit expensive material to RF layers |
Material families
FR-4
Standard and lead-free FR-4 from Shengyi, ITEQ, TUC, Panasonic and EMC.
Learn moreTg150 / Tg170High-Tg FR-4
For heat exposure, multiple reflows and thick constructions.
Learn moreRF / microwaveRogers
RO3000 and RO4000 series for stable dielectric properties.
Learn moreHigh-speed / low-lossIsola
370HR, FR408HR, I-Speed, I-Tera MT40, Tachyon 100G, TerraGreen.
Learn moreRF / microwavePTFE
Arlon CLTE, Taconic RF-35 and Shengyi SCGA-500.
Learn moreOverviewAll materials
The full material capability list with Dk, Df and Tg data.
Learn more